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 2SC5631
Silicon NPN Epitaxial UHF / VHF Wide Band Amplifier
REJ03G0128-0300Z (Previous ADE-208-981A(Z)) Rev.3.00 Oct.20.2003
Features
* High gain bandwidth product fT = 11 GHz typ. * High power gain and low noise figure ; PG = 10 dB typ. , NF = 1.2 dB typ. at f = 900 MHz
Outline
UPAK
3
2
1
4 1. Base 2. Collector 3. Emitter 4. Collector
Note: Marking is "JR".
Rev.3.00, Oct.20.2003, page 1 of 9
2SC5631
Absolute Maximum Ratings
(Ta = 25C)
Item Collector to base voltage Collector to emitter voltage Emitter to base voltage Collector current Collector power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC Pc Tj Tstg Ratings 15 6 1.5 80 800* 150 -55 to +150 Unit V V V mA mW C C
* When using alumina ceramic board (12.5 x 20 x 0.7 mm)
Electrical Characteristics
(Ta = 25C)
Item Collector to base breakdown voltage Collector cutoff current Collector cutoff current Emitter cutoff current DC current transfer ratio Collector output capacitance Gain bandwidth product Power gain Noise figure Symbol V(BR)CBO ICBO ICEO IEBO hFE Cob fT PG NF Min 15 -- -- -- 80 -- 8 7 -- Typ -- -- -- -- 120 1.6 11 10 1.2 Max -- 1 1 10 160 2.2 -- -- 1.9 Unit V A mA A V pF GHz dB dB Test Conditions IC = 10 A , IE = 0 VCB = 12 V , IE = 0 VCE = 6 V , RBE = VEB = 1.5 V , IC = 0 VCE = 5 V , IC = 50 mA VCB = 5 V , IE = 0 f = 1 MHz VCE = 5 V , IC = 50 mA f = 1 GHz VCE = 5 V , IC = 50 mA f = 900 MHz VCE = 5 V , IC = 5 mA f = 900 MHz
Rev.3.00, Oct.20.2003, page 2 of 9
2SC5631
Main Characteristics
Collector Power Dissipation Curve DC Current Transfer Ratio vs. Collector Current
Pc (mW)
1600
200
DC Current Transfer Ratio
1200
hFE
Collector Power Dissipation
VCE = 5 V 100
800
3V
400
0 0 50 100 150 Ta (C) 200 1 2 5 10 20 IC 50 (mA) 100
Ambient Temperature
Collector Current
(pF)
4.0
Collector Output Capacitance vs. Collector to Base Voltage IE = 0 f = 1MHz
20
Gain Bandwidth Product vs. Collector Current
Cob
(GHz) fT Gain Bandwidth Product
3.2
16
Collector Output Capacitance
2.4
12 8
VCE = 5 V 3V
1.6
0.8
4
0 0.1
0 1 2 5 10 20 IC 50 (mA) 100
0.2
0.5
1
2
5
10
Collector to Base Voltage
VCB (V)
Collector Current
Rev.3.00, Oct.20.2003, page 3 of 9
2SC5631
Power Gain vs. Collector Current 20 f = 900 MHz
NF (dB)
Noise Figure vs. Collector Current 5 f = 900 MHz 4
16
(dB)
PG
12 VCE = 5 V 8 3V
3
VCE = 3 V
Power Gain
Noise Figure
2 5V 1
4
0 1
0 2 5 10 20 IC 50 (mA) 100 1 2 5 10 20 IC 50 (mA) 100
Collector Current
Collector Current
20
|S21|2 (dB)
S21Parameter vs. Collector Current f = 1 GHz
16
12 VCE = 5 V 8 3V
S21 Parameter
4
0 1 2 5 10 20 IC 50 (mA) 100
Collector Current
Rev.3.00, Oct.20.2003, page 4 of 9
2SC5631
S21 Paramter vs. Frequency
90 2 .4 3 .2 4 5 10 0 .2 .4 .6 .8 1 1.5 2 3 45 10 -10 -.2 -5 -4 -3 -.4 -.6 -.8 -1 -1.5 -2 -120 -90 180 0 150 30 120
S11 Parameter vs. Frequency
.8 .6 1 1.5
Scale: 6 / div.
60
-150
-30
-60
Condition : VCE = 3 V , IC = 50 mA 100 to 2000 MHz (100 MHz step)
Condition : VCE = 3 V , IC = 50 mA 100 to 2000 MHz (100 MHz step)
S12 Parameter vs. Frequency
90 120
S22 Parameter vs. Frequency
.8 .6 .4 3 1 1.5 2
Scale: 0.1 / div.
60
150
30
.2
4 5 10
180
0
0
.2
.4
.6 .8 1
1.5 2
3 45
10
-10
-.2
-150
-30
-.4 -2 -.6 -.8 -1 -1.5
-5 -4 -3
-120
-60 -90
Condition : VCE = 3 V , IC = 50 mA 100 to 2000 MHz (100 MHz step)
Condition : VCE = 3 V , IC = 50 mA 100 to 2000 MHz (100 MHz step)
Rev.3.00, Oct.20.2003, page 5 of 9
2SC5631
S21 Paramter vs. Frequency
90 2 .4 3 .2 4 5 10 0 .2 .4 .6 .8 1 1.5 2 3 45 10 -10 -.2 -5 -4 -3 -.4 -.6 -.8 -1 -1.5 -2 -120 -90 180 0 150 30 120
S11 Parameter vs. Frequency
.8 .6 1 1.5
Scale: 6 / div.
60
-150
-30
-60
Condition : VCE = 5 V , IC = 50 mA 100 to 2000 MHz (100 MHz step)
Condition : VCE = 5 V , IC = 50 mA 100 to 2000 MHz (100 MHz step)
S12 Parameter vs. Frequency
90 120
S22 Parameter vs. Frequency
.8 .6 .4 3 1 1.5 2
Scale: 0.1 / div.
60
150
30
.2
4 5 10
180
0
0
.2
.4
.6 .8 1
1.5 2
3 45
10
-10
-.2
-150
-30
-.4 -2 -.6 -.8 -1 -1.5
-5 -4 -3
-120
-60 -90
Condition : VCE = 5 V , IC = 50 mA 100 to 2000 MHz (100 MHz step)
Condition : VCE = 5 V , IC = 50 mA 100 to 2000 MHz (100 MHz step)
Rev.3.00, Oct.20.2003, page 6 of 9
2SC5631
S parameter
(VCE = 3V, IC = 50 mA, Zo = 50 )
S11 f (MHz) MAG 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 0.234 0.233 0.234 0.238 0.242 0.249 0.250 0.259 0.267 0.274 0.282 0.290 0.297 0.307 0.318 0.324 0.334 0.345 0.357 0.366 ANG -135.7 -165.2 179.3 170.1 161.2 153.9 145.9 140.4 134.2 128.0 123.5 119.2 114.2 109.6 105.3 101.7 97.7 93.9 91.6 87.9 S21 MAG 26.57 13.47 8.92 6.70 5.37 4.52 3.89 3.43 3.08 2.80 2.58 2.40 2.25 2.12 2.01 1.92 1.83 1.77 1.72 1.65 ANG 109.9 96.1 89.7 84.9 81.2 77.8 74.5 71.4 68.6 65.8 63.2 60.3 57.9 55.9 53.4 51.3 48.6 46.8 44.6 42.6 S12 MAG 0.0299 0.0575 0.0863 0.114 0.142 0.169 0.196 0.223 0.249 0.275 0.299 0.323 0.346 0.367 0.389 0.409 0.430 0.448 0.468 0.485 ANG 75.5 78.0 77.8 76.9 75.4 73.9 72.2 70.4 68.4 66.9 65.0 63.2 61.3 59.7 57.8 56.2 54.4 52.8 50.9 49.5 S22 MAG 0.353 0.199 0.153 0.135 0.127 0.124 0.125 0.126 0.128 0.131 0.136 0.140 0.144 0.149 0.153 0.159 0.163 0.170 0.174 0.180 ANG -77.7 -99.6 -112.5 -121.8 -128.3 -133.5 -138.0 -141.3 -145.0 -147.7 -150.3 -153.0 -155.6 -158.1 -160.5 -162.7 -165.1 -167.9 -170.2 -172.6
Rev.3.00, Oct.20.2003, page 7 of 9
2SC5631
S parameter
(VCE = 5V, IC = 50 mA, Zo = 50 )
S11 f (MHz) MAG 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 0.205 0.193 0.190 0.193 0.201 0.206 0.206 0.221 0.224 0.234 0.243 0.249 0.261 0.270 0.280 0.285 0.298 0.312 0.321 0.330 ANG -123.9 -159.6 -177.1 169.9 162.0 153.7 145.4 139.0 132.6 126.8 120.8 116.8 111.3 107.4 103.5 99.1 95.4 91.8 87.9 85.6 S21 MAG 28.04 14.24 9.44 7.09 5.68 4.76 4.11 3.62 3.25 2.94 2.72 2.53 2.36 2.23 2.10 2.01 1.92 1.84 1.79 1.71 ANG 110.8 96.9 90.2 85.3 81.8 78.4 75.1 72.2 69.4 66.6 64.0 61.3 59.0 56.9 54.5 52.1 50.3 47.6 45.7 43.8 S12 MAG 0.0284 0.0547 0.0820 0.109 0.135 0.162 0.188 0.213 0.238 0.262 0.286 0.309 0.331 0.353 0.373 0.393 0.414 0.431 0.450 0.467 ANG 74.9 78.2 78.3 77.5 76.3 74.6 72.9 71.3 69.4 67.8 66.0 64.3 62.5 60.9 59.1 57.6 56.0 54.3 52.5 51.4 S22 MAG 0.360 0.197 0.145 0.123 0.112 0.107 0.105 0.105 0.106 0.110 0.113 0.117 0.120 0.125 0.129 0.135 0.139 0.145 0.148 0.155 ANG -69.1 -84.5 -92.5 -99.0 -104.1 -109.5 -113.7 -117.6 -121.8 -125.4 -128.7 -132.0 -135.5 -138.7 -142.0 -144.9 -148.1 -151.3 -154.5 -157.5
Rev.3.00, Oct.20.2003, page 8 of 9
2SC5631
Package Dimensions
As of January, 2003
Unit: mm
4.5 0.1
1.5 1.5 3.0
0.8 Min
0.44 Max
Package Code JEDEC JEITA Mass (reference value)
(0.4)
0.53 Max 0.48 Max
(2.5)
1
2.5 0.1 4.25 Max
0.4
1.8 Max
1.5 0.1 0.44 Max
(1.5)
UPAK -- Conforms 0.050 g
Rev.3.00, Oct.20.2003, page 9 of 9
(0.2)
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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http://www.renesas.com
(c) 2003. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon 1.0


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